Qualcomm Technology Development Manager in Wuxi, China
Technology Development Manager
Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Engineering - Hardware
China - Wuxi
-Lead and handling new package technology projects according to package roadmap and product requrements, and coordinate with inhouse team and Subcon to ensure new technolgy projects on time delivery with quality.
-Support module process development of SIP , Flipchip ( SMT/ Flipchip, Die attach/Wirebond/ Mold/Ball attach/Sputtering/Laser) .
-Work with inhouse and Subcon to ensure new package technology fullfill roadmap and requirements.
-Lead team to design and perform DOE to optimize the process and define the process window.
-Perform FMEA for new product and design method to mitigate the risk during development.
-Work with operation team and Subcon to smoothly release new product into production.
-Reguarly project monthly reveiw and update with global team ( Operation and BU).
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
5+ years Hardware Engineering experience or related work experience.
-BGA/LGA/PoP package or SIP module process development is preferred.
-Excellent Project management Skill.
-Experienced in using IC package assembly equipment and process
-Good SPC and DOE knowledge
Bachelor's Degree or above in Electrical/Electronics/Materials/Mechanical Engineering or related.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.