Qualcomm Wafer / Die Preparation Service (DPS / BE2) Package Engineer, Senior to Staff level in Taiwan
Wafer / Die Preparation Service (DPS / BE2) Package Engineer, Senior to Staff level
Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Engineering - Manufacturing/Quality/Other
The die preparation process engineer will be a key member of Taiwan bumping team responsible of technology development, new product introduction (NPI) and high-volume production across various silicon technology nodes, foundries, bumping lines and assembly houses for 300 mm and 200 mm wafers.
The job scope includes:
Develop best know methods (BKM) and control plan
Set up wafer back-grinding, laser marking, laser grooving, singulation, die pick and place, tape and reel process for product and test vehicle
Qualify new technology, process, product, material and equipment characterizing key parameters
Drive metrology matching, machine fan out and cycle time reduction
Drive production ramp up and continuous process improvement, and support process change request
Contain, root cause and resolve production issue
The candidate is expected to work closely with foundry backend turn key teams, OSATs bumping, DPS (BE2) and assembly teams, and internal package design and process teams, quality and product development teams to deliver best-in-class NPI and production execution for Qualcomms products.
Fundamental understanding of silicon backend and packaging, wafer thinning and taping, laser grooving and die singulation, packaging material and equipment
Strong technical skills in process, material and equipment characterization, failure analysis and FMEA
Strong technical skills in DOE design and statistical data analysis
Good analytical and project management skills
Good verbal and written communication skills
Minimum three years of hands on experience in die preparation.
Highly motivated and committed to success of the individual and the team.
Able to work flexible hours. Occasional domestic/international travels needed.
Experienced with interfacing with foundries, bumping lines and assembly houses. Hands-on experience in leading projects and OSATs management in silicon backend, bumping, packaging for advanced technologies. Additional experience in flip chip bumping and package assembly development is a plus.
Education Requirements: B.S., M.S. Mechanical Engineering, Materials Science, or equivalent.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.