Qualcomm Wafer / Die Preparation Service (DPS / BE2) Package Engineer, Senior to Staff level in Taiwan

Job Description:

Job Id

E1968842

Job Title

Wafer / Die Preparation Service (DPS / BE2) Package Engineer, Senior to Staff level

Post Date

01/02/2019

Company


Division

Qualcomm Technologies, Inc.


CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering - Manufacturing/Quality/Other

Location

Taiwan

Job Overview

The die preparation process engineer will be a key member of Taiwan bumping team responsible of technology development, new product introduction (NPI) and high-volume production across various silicon technology nodes, foundries, bumping lines and assembly houses for 300 mm and 200 mm wafers.

The job scope includes:

Develop best know methods (BKM) and control plan

Set up wafer back-grinding, laser marking, laser grooving, singulation, die pick and place, tape and reel process for product and test vehicle

Qualify new technology, process, product, material and equipment characterizing key parameters

Drive metrology matching, machine fan out and cycle time reduction

Drive production ramp up and continuous process improvement, and support process change request

Contain, root cause and resolve production issue

The candidate is expected to work closely with foundry backend turn key teams, OSATs bumping, DPS (BE2) and assembly teams, and internal package design and process teams, quality and product development teams to deliver best-in-class NPI and production execution for Qualcomms products.

Minimum Qualifications

Skill/Knowledge:

Fundamental understanding of silicon backend and packaging, wafer thinning and taping, laser grooving and die singulation, packaging material and equipment

Strong technical skills in process, material and equipment characterization, failure analysis and FMEA

Strong technical skills in DOE design and statistical data analysis

Good analytical and project management skills

Good verbal and written communication skills

Minimum three years of hands on experience in die preparation.

Highly motivated and committed to success of the individual and the team.

Able to work flexible hours. Occasional domestic/international travels needed.

Preferred Qualifications

Experienced with interfacing with foundries, bumping lines and assembly houses. Hands-on experience in leading projects and OSATs management in silicon backend, bumping, packaging for advanced technologies. Additional experience in flip chip bumping and package assembly development is a plus.

Education Requirements

Education Requirements: B.S., M.S. Mechanical Engineering, Materials Science, or equivalent.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.