Qualcomm Jobs

Company:

Qualcomm China

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Job overview: Member of IC packaging team directly supporting customers with packaging related quality issues, product development and new applications. Daily support for mechanical FA lab operation and packaging issues triage

Examples of customer support areas:

• Board level reliability (BLR) qualification.

• SMT (Surface Mount Technology)

• Packaging SMT/ BLR issue triage and root cause isolation

• Product launch into HVM (High Volume Manufacture)

• Design for manufacturability (DFM) reviews

• Technology roadmap alignment and spec compliance reviews

• Failing samples reviews

• Publication of application notes and process recommendations

Examples of lab operations support areas:

• FA (Failure Analysis) plan definition

• FA reports

• Lab daily operations supervisory

• Supports to technicians

Examples of advanced package technologies supported

• BGA (Ball Grid Array) and CSP (Chip Scale Package)

• WLP (Wafer Level Package)

• FO-WLP (Fan Out Wafer Level Package)

• PoP (Package on Package)

• LGA (Land Grid Array)

Other duties as needed

• Collaboration with internal teams (quality, design, NPI, modeling, etc) to give regular profess updates

• Project/ case management; statistical analysis including DOE methods

• Interface with external suppliers and equipment vendors to understand latest technologies

• Industrial benchmarking and competitive analysis

Minimum qualifications

• Required to be fluent in Mandarin with functional proficiency in English

• Permitted to work in mainland China with ability for oversea travel

• Minimum of five years of experience in SMT/ BLR and package technology development

• Must have strong written and oral communication

Working knowledge of

• Package assembly process

• Surface mount technology

• Package reliability testing and failure modes

• Underfill & rework

• High temperature warpage analysis

• Industry packaging trends and customer considerations

• Package material analysis

• Mechanical failure analysis techniques

• Failure analysis tools & data analysis (Microscope/ Shadow Morrie/ X-ray/ CSAM/ EDX/ IR…)

• IPC JEDEC and other industry specifications

Preferred qualifications

• Independent decision maker and problem solver with little oversight needed

• Previous experience with portable consumer products/ auto products and direct manufacturing experience with package assembly or SMT strongly preferred

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.

Qualcomm is an equal opportunity employer and supports workforce diversity.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification