Qualcomm Jobs

Job Information

Qualcomm FY24 Summer Intern-Hardware engineer in Shanghai, China

Company:

Qualcomm China

Job Area:

Interns Group, Interns Group > Interim Engineering Intern - HW

General Summary:

Main Responsibilities:

IPS Shanghai Team is HW R&D in QCOM, responsible for QC Chipset verification and refrence platform design. We have Baseband, RF, System, Validation, eCAD, mCAD, 6 sub teams. Focus on:

  1. Chipset reference design

  2. Chipset verification platform design

  3. Chipset solution HW test

  4. Bugfix and Optimization

Skills / Experience Required:

Basic Request

  1. Familiar with Analog and Digital Circuit, including Amplifier, LDO &DCDC, ADC&DAC, etc.

  2. Familiar with Wireless and Microwave, including impedence, Smith chart, PA, etc.

  3. Know High speed signal design, including stripe line, micro stripe line, Z0, etc.

  4. Know Wireless Communication, including Cellular Modem, Modulization, SPSP, Coding, etc.

  5. Know VLSI, include CMOS Logic, IO model, Timing, etc.

  6. CET-4

Preferred:

  1. Experience in RF circuit design or debug

  2. Experence in Power circuit design or debug

  3. Experence in applicaiton design of MCU or SoC

  4. Strong speaking English. CET-6 or equal

Education Requirements (Degree Major, GPA, Courses):

Electrical Engineering, Communication and Computer Science or related

Bachler or above

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If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification

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