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Qualcomm Packaging Engineer in San Jose, California

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Come join us and create what has yet to be imagined. Qualcomm invents foundational technologies that transform how the world connects, computes, and communicates. Building on our legacy of breakthrough development in 5G, Wi-Fi and AI, we design platforms, chipsets, software, tools and services that bring those technologies into end products that change the way we live and work across a range of industries from automotive to virtual reality, from smart cars to smartphones to smart cities, and everything in between. We are a brand of inventors for innovators. When we break through, the world leaps forward.

This highly visible role is a key member of the Qualcomm Packaging Engineering team responsible for the roadmap, architecture, design methodology, design implementation and verification for all Qualcomm product packages and the development of packaging solutions in collaboration with cross-functional internal teams and management of outside suppliers to ensure delivery on program timelines and goals.

This position is a role for an experienced, motivated Packaging Engineer responsible for developing advanced packaging technologies and defining baseline assembly processes that are optimized for performance, reliability, yield and cost across multiple product application spaces including 5G mobile, high performance computing, automotive, IoT, etc.

Success in this role requires extensive knowledge and experience in package architecture, assembly processes, thermal and mechanical analysis, materials and chip-package-interactions as well as the ability to lead cross-functional teams, manage multiple foundries and OSATs, and resolve complex technical issues.

Minimum Qualifications:

• Master’s degree in Mechanical, Electrical or Materials Engineering or equivalent.

• 5+ years of experience in advanced packaging technology development, new product introduction, and high volume manufacturing.

• Hands-on experience in packaging assembly processes, materials, equipment, and design rules.

• Good understanding in package architecture, high density interconnect, performance, thermal-mechanical, reliability, and cost constraints.

• Experience working with foundries and OSATs to bring up packaging solutions from concept to HVM.

• Excellent verbal and written communication skills.

• Demonstrated organized technical project management skills.

• Ability to work independently and lead multiple programs.

• Ability to lead multi-functional teams to solve complex technical problems.

Preferred Qualifications

  • Ph.D. in Mechanical, Electrical or Materials Engineering or equivalent.

  • 7+ years of experience in semiconductor packaging technology and process development or related work experience.

  • Expertise in advanced packaging technologies such as flip chip, WLP, MCM, 2.5D and 3D.

  • Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products.

  • Knowledge of reliability standard, test methods, qualification procedure, and FA techniques.

  • Familiar with substrate manufacturing processes and design rules.

Applicants : If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

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