Qualcomm IC Package Engineer in San Diego, California

Job Description:

Job Id


Job Title

IC Package Engineer

Post Date




Qualcomm Technologies, Inc.

CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering - Hardware


California - San Diego

Job Overview

We are looking for a highly motivated packaging engineer capable of leading state-of-the-art fan-out wafer-level and panel-level package technology projects. You will be responsible for advanced IC packaging development and new product introduction of leading-edge package technologies for the mobile market and driving that innovation into high volume manufacturing at assembly suppliers. Extensive knowledge and experience in fan-out package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Some international travel will be required.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Minimum Qualifications

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

  • 5+ years Hardware Engineering experience or related work experience.

Preferred Qualifications

  • 10 years of experience in the development and high-volume manufacturing of advanced IC packages.

  • Expertise in the wafer-level, fan-out wafer-level, and panel-level packaging materials, assembly processes, equipment, and design rules.

  • Excellent verbal and written communication skills.

  • Exhibit organized technical project management skills (preferably, involving off-shore factories).

  • Able to work independently and lead multiple programs.

  • Able to lead multi-functional teams to solve complex technical problems.

  • Self-driven, passionate, and creative.

  • Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.

  • Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.

  • Proficiency in material and package characterization data analysis, and statistical data analysis.

  • Knowledge of reliability test methods and qualification procedure.

  • Six Sigma Green or Black belt a plus.

Education Requirements

Required: Bachelor's, Electrical Engineering

Preferred: Master's, Electrical Engineering

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.