Qualcomm Intern, Thermal Engineer (Taiwan) in Hsinchu, Taiwan

Job Description:

Job Id


Job Title

Intern, Thermal Engineer (Taiwan)

Post Date




Qualcomm Technologies, Inc.

CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering - Hardware


Taiwan - Hsinchu

Job Overview

Qualcomms Packaging Organization is seeking a talented intern to contribute to continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be part of a larger Thermal Engineering Team contributing to innovative solutions to complex thermal mgmt. challenges. Such individual should have in-depth understanding of heat transfer fundamentals and be familiar to electronics cooling applications. He/she must be experienced in creating analytical and numerical models utilizing CFD tools. In addition, experience in conducting thermal experiments in support of various product development efforts is a must. Further, intimate knowledge of thermal mgmt. materials and their applications to enhance hardware thermal performance is required.

-Assist Thermal Engineers in conducting various tasks such as analysis, test, and customer and suppliers support.

-Perform thermal simulations utilizing CFD tools for package and product-level solutions.

-Design, set up, run experiments/tests and deliver results for various thermal or mechanical experiments.

-Conduct test or research on materials and thermal solutions.

Minimum Qualifications

-Minimum 2 years of graduate-level course work in Heat Transfer, Thermodynamics, and Fluid Dynamics.

-Thorough understanding of cooling techniques for electronic components and equipment.

-In-depth understanding of natural and forced convection cooling.

-Must understand functions and applications of semiconductors, PCBs, component placement, enclosures, and heat sinks.

-Experience in conducting CFD simulations utilizing tools such as ANSYS-Icepak or Flotherm.

-Ability to design thermal tests and execute per plan within a laboratory environment.

-Some experience with 3D geometry CAD tools such as Solidworks or Pro/ENGINEER.

-Experience operating data acquisition equipment.

-Excellent communication skills.

Preferred Qualifications

Commitment of at least 3 month internship working not less than 20 hours a week.

Education Requirements


EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.