Job Information
Qualcomm Package/System Design Engineer, Senior in Hsinchu City, Taiwan
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm Overview:
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
General Summary:
The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).
Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network, and thermal constraints.
Additional responsibilities:
IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment
System level co-design methodology of IC, Package and PCB/Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels
Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Minimum Qualifications
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
2+ years Hardware Engineering experience or related work experience.
Preferred Qualifications
Experience in IC package and/or PCB selection , design , and layout experience - Experience in Pinmap optimization of optimal PCB design
Experience with DDR3/DDR4 layout process
Experience or knowledge in PCB design process like Schematic capture
Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis
Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
Working knowledge of die floor planning, IO placement, and bump placement
Working knowledge of Chip, Package and PCB co-design methodology
Familiar with assembly and substrate manufacturing process
Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with PCB stack-up and breakout strategy
Educational Requirements
Bachelor's Electrical Engineering and/or Mechanical Engineering.
Preferred: Master's, Electrical Engineering.
Applicants : If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
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If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification